| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Taiwan | 3 | |
| #2 | United States | 3 | |
| #3 | China | 2 | |
| #4 | Republic of Korea | 2 | |
| #5 | Malaysia | 2 | |
| #6 | Japan | 1 | |
| #7 | Singapore | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Machines | |
| #3 | Electrical machinery and energy | |
| #4 | Materials and metallurgy |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Unspecified technologies | |
| #3 | Electrically-conductive connections | |
| #4 | Unspecified technologies | |
| #5 | Alloys |
| # | Name | Total Patents |
|---|---|---|
| #1 | Chan Tat Chi | 8 |
| #2 | Kwan Yiu Fai | 7 |
| #3 | Yau Chun Ho | 5 |
| #4 | Chi Chan Tat | 4 |
| #5 | Ho Yau Chun | 4 |
| #6 | Fai Kwan Yiu | 3 |
| #7 | Lee Chi Chung | 3 |
| #8 | Cheng Man Shing | 2 |
| #9 | Chan Wai | 2 |
| #10 | Mincheng Zheng | 1 |
| Publication | Filing date | Title |
|---|---|---|
| TW201025539A | Micro-blasting treatment for lead frames | |
| TW200816441A | Stamped leadframe and method of manufacture thereof | |
| US2008233683A1 | Pre-plated leadframe having enhanced encapsulation adhesion | |
| US2008216921A1 | Leadframe treatment for enhancing adhesion of encapsulant thereto | |
| US2006110855A1 | Leadframe with enhanced encapsulation adhesion |