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UNITED INTEGRATED CIRCUITS CORP

Overview
  • Total Patents
    49
About

UNITED INTEGRATED CIRCUITS CORP has a total of 49 patent applications. Its first patent ever was published in 1997. It filed its patents most often in United States, Japan and Taiwan. Its main competitors in its focus markets semiconductors, optics and computer technology are SEMICONDUCTOR LEADING EDGE TEC, NANJING JINGQU INTEGRATED CIRCUIT CO LTD and PROCESS LAB MICRON CO LTD.

Patent filings in countries

World map showing UNITED INTEGRATED CIRCUITS CORPs patent filings in countries
# Country Total Patents
#1 United States 37
#2 Japan 5
#3 Taiwan 5
#4 France 1
#5 Netherlands 1

Patent filings per year

Chart showing UNITED INTEGRATED CIRCUITS CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Chen Weng-Yi 5
#2 Chen Kuen-Chu 5
#3 Hsia Liang-Choo 4
#4 Sung Kuo-Tung 3
#5 Lu Jau-Hone 3
#6 Ko Injo 2
#7 Lu Chang-Ming 2
#8 Wang Kuang-Chih 2
#9 Lee Michael 2
#10 Wei Chi-Hung 2

Latest patents

Publication Filing date Title
US6207498B1 Method of fabricating a coronary-type capacitor in an integrated circuit
US6108258A Sense amplifier for high-speed integrated circuit memory device
US6221747B1 Method of fabricating a conductive plug with a low junction resistance in an integrated circuit
US6188243B1 Input/output circuit with high input/output voltage tolerance
US6136698A Method of increasing contact area of a contact window
US6130573A Voltage boosting circuit having asymmetric MOS in DRAM
US5990523A Circuit structure which avoids latchup effect
US6033968A Method for forming a shallow trench isolation structure
US6110796A Method of improving junction leakage problem of shallow trench isolation by covering said STI with an insulating layer during salicide process
US6071094A Photoresist dispense pump
US6121095A Method for fabricating gate oxide
US6066550A Method of improving selectivity between silicon nitride and silicon oxide
US6132078A Slurry providing system
US6100573A Structure of a bonding pad for semiconductor devices
US6084240A Ion implanter
US6136515A Method for removing photoresist in metallization process
TW380280B Manufacturing method for dummy wafer
TW378280B Compatible mask
TW413903B Method for forming contact window
NL1009204C2 Embedded DRAM produced by simplified, reduced cost process