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CSMC TECH CORP

Overview
  • Total Patents
    21
  • GoodIP Patent Rank
    79,651
About

CSMC TECH CORP has a total of 21 patent applications. Its first patent ever was published in 2014. It filed its patents most often in China. Its main competitors in its focus markets semiconductors and optics are ITO YOSHITAKE, NANJING JINGQU INTEGRATED CIRCUIT CO LTD and PROCESS LAB MICRON CO LTD.

Patent filings in countries

World map showing CSMC TECH CORPs patent filings in countries
# Country Total Patents
#1 China 21

Patent filings per year

Chart showing CSMC TECH CORPs patent filings per year from 1900 to 2020

Focus industries

# Industry
#1 Semiconductors
#2 Optics

Top inventors

# Name Total Patents
#1 Hu Jun 5
#2 Li Jian 5
#3 Luan Huiqian 3
#4 Li Yuhua 2
#5 Wang Yachao 2
#6 Zhou Jun 1
#7 Liu Lulin 1
#8 Li Xiaoming 1
#9 Cui Yilong 1
#10 Chen Yawei 1

Latest patents

Publication Filing date Title
CN106873306A A kind of reticle and photolithography method
CN106847682A A kind of manufacture method of semiconductor devices
CN106816370A A kind of manufacture method of semiconductor devices
CN106597818A Contraposition mark, method for forming contraposition mark, and semiconductor device
CN106569395A Photomask for measuring light leakage of exposure machine and method thereof
CN106569386A A photomask and a method of performing simultaneous preparation of a plurality of chips by utilizing the photomask
CN106558486A The method for removing semiconductor chip mask layer
CN106556973A Photoetching method
CN106531685A Interlayer dielectric layer, and etching method of contacts in the interlayer dielectric layer
CN106486417A The method of lifting crystal edge yield
CN106328500A Tungsten film deposition method
CN106328582A Formation method and HDPCVD method for metal interlay dielectric film layer
CN106154758A Alignment matching process between different litho machines
CN106158644A The grid structure of semiconductor device and prevent its method producing cavity
CN106033732A Method for monitoring metal element content of side wall of contact hole and wafer
CN105990173A Bonding pad thickness monitoring method and wafer with bonding pad thickness monitoring structure
CN105845542A Anticorrosion apparatus for washing cavity of semiconductor tail gas treatment device
CN105839073A Anti-tripping structure for chemical vapor deposition apparatus
CN105448649A Configuration method for exposure units
CN105448891A Monitoring wafer for edge removing width and manufacturing method thereof