UBOTIC COMPANY LTD has a total of 19 patent applications. It decreased the IP activity by 60.0%. Its first patent ever was published in 2014. It filed its patents most often in United States, China and EPO (European Patent Office). Its main competitors in its focus markets semiconductors, audio-visual technology and measurement are SHIM IL KWON, CHANG CHIANG-CHENG and OHKUCHI ELECTRONICS CO LTD.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 12 | |
#2 | China | 5 | |
#3 | EPO (European Patent Office) | 2 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Audio-visual technology | |
#3 | Measurement | |
#4 | Micro-structure and nano-technology |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Casings and printed circuits | |
#3 | Measuring volume | |
#4 | Microstructural devices |
# | Name | Total Patents |
---|---|---|
#1 | Fan Chun Ho | 8 |
#2 | Tam Ming-Wa | 5 |
#3 | Chun Ho Fan | 3 |
#4 | Wai Sin Chi | 2 |
#5 | Ping Zhang Xiao | 2 |
#6 | Leung Wa San | 2 |
#7 | Wan Ken Lik Hang | 1 |
#8 | Wan Lik Hang | 1 |
#9 | Shan Zhihui | 1 |
#10 | Zhang Xiaoping | 1 |
Publication | Filing date | Title |
---|---|---|
US2019103313A1 | Carrier substrate, package, and method of manufacture | |
US2019063971A1 | Mass flow sensor module and method of manufacture | |
US9991194B1 | Sensor package and method of manufacture | |
US2017170102A1 | High power and high frequency plastic pre-molded cavity package | |
US2016020177A1 | Radio frequency shielding cavity package | |
US2015060116A1 | Cavity package with pre-molded substrate | |
US2015061094A1 | Cavity package with pre-molded cavity leadframe | |
CN104299948A | Cavity package |