TSK AMERICA INC has a total of 15 patent applications. Its first patent ever was published in 1997. It filed its patents most often in United States, EPO (European Patent Office) and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets machine tools, machines and semiconductors are SPEEDFAM IPEC CORP, STRASBAUGH INC and HANGZHOU SIZONE ELECTRONIC TECH INC.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 4 | |
#2 | EPO (European Patent Office) | 3 | |
#3 | WIPO (World Intellectual Property Organization) | 3 | |
#4 | Australia | 2 | |
#5 | Japan | 2 | |
#6 | Canada | 1 |
# | Industry | |
---|---|---|
#1 | Machine tools | |
#2 | Machines | |
#3 | Semiconductors | |
#4 | Measurement |
# | Name | Total Patents |
---|---|---|
#1 | Montoya Thomas T | 7 |
#2 | Farzan Farshad | 2 |
#3 | Epstein Jack | 2 |
#4 | Steere Jr Robert E | 2 |
#5 | Steere Robert E | 2 |
#6 | Steere Iii Robert E | 2 |
#7 | Paulison Lee | 2 |
#8 | Steere Robert E Iii | 1 |
#9 | Steere Colby R | 1 |
Publication | Filing date | Title |
---|---|---|
US6306016B1 | Wafer notch polishing machine and method of polishing an orientation notch in a wafer | |
EP1050898A2 | An apparatus and method for aligning a processed wafer for regrinding and/or polishing | |
WO2004011953A1 | Spiral chuck | |
AU3749800A | Prober interface plate | |
US6290274B1 | Vacuum system and method for securing a semiconductor wafer in a planar position | |
US6271676B1 | Spiral chuck | |
US6055694A | Wafer scrubbing machine | |
EP0898694A1 | Translation and rotation coupled positioning method and apparatus |