STRASBAUGH INC has a total of 35 patent applications. Its first patent ever was published in 1999. It filed its patents most often in WIPO (World Intellectual Property Organization), Taiwan and Australia. Its main competitors in its focus markets machine tools, semiconductors and machines are FUJIKOSHI MACHINERY CORP, CALITECH CO LTD and NIPPON SEIMITSU DENSHI CO LTD.
# | Country | Total Patents | |
---|---|---|---|
#1 | WIPO (World Intellectual Property Organization) | 8 | |
#2 | Taiwan | 7 | |
#3 | Australia | 6 | |
#4 | United States | 6 | |
#5 | China | 2 | |
#6 | EPO (European Patent Office) | 2 | |
#7 | Republic of Korea | 2 | |
#8 | Japan | 1 | |
#9 | Malaysia | 1 |
# | Industry | |
---|---|---|
#1 | Machine tools | |
#2 | Semiconductors | |
#3 | Machines | |
#4 | Packaging and shipping |
# | Technology | |
---|---|---|
#1 | Grinding or polishing devices | |
#2 | Semiconductor devices | |
#3 | Manipulators | |
#4 | Unspecified technologies | |
#5 | Grinding tools | |
#6 | Unspecified technologies | |
#7 | Turning | |
#8 | Accessories for machine tools |
# | Name | Total Patents |
---|---|---|
#1 | Halley David G | 12 |
#2 | Kassir Salman M | 8 |
#3 | Wolf Stephan H | 7 |
#4 | Barbour Gregory L | 5 |
#5 | Smedley Benjamin C | 4 |
#6 | Treur Randolph E | 3 |
#7 | Lentz Terry L | 3 |
#8 | Kalenian Bill | 3 |
#9 | Boyd John M | 3 |
#10 | Spiegel Larry A | 2 |
Publication | Filing date | Title |
---|---|---|
US2016288291A1 | Method for grinding wafers by shaping resilient chuck covering | |
WO2004091856A2 | Grinding apparatus and method | |
MY135787A | A method of backgrinding wafers while leaving backgrinding tape on a chuck | |
JP2004241511A | Multi-action chemical machine flattening device and flattening method therefor | |
WO0226445A1 | Polishing pad with built-in optical sensor | |
WO0226441A1 | Tool for applying resilient tape to chuck used for grinding or polishing wafers | |
US6146242A | Optical view port for chemical mechanical planarization endpoint detection | |
US6183341B1 | Slurry pump control system | |
US6131589A | Accurate positioning of a wafer | |
US6254155B1 | Apparatus and method for reliably releasing wet, thin wafers |