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INTEGRATED PROCESS EQUIPMENT C

Overview
  • Total Patents
    26
About

INTEGRATED PROCESS EQUIPMENT C has a total of 26 patent applications. Its first patent ever was published in 1990. It filed its patents most often in United States, EPO (European Patent Office) and Israel. Its main competitors in its focus markets machine tools, machines and semiconductors are SPEEDFAM IPEC CORP, TSK AMERICA INC and TIANJIN HWATSING TECH COMPANY LTD.

Patent filings per year

Chart showing INTEGRATED PROCESS EQUIPMENT Cs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Adams John A 8
#2 Krulik Gerald A 8
#3 Harwood C Randall 4
#4 Lee Junedong 2
#5 Lefton Kenneth D 2
#6 Ledger Anthony M 2
#7 Smith Everett D 2
#8 Charif Malek 2
#9 Barns Chris E 2
#10 Griffin Justin J 2

Latest patents

Publication Filing date Title
US6121152A Method and apparatus for planarization of metallized semiconductor wafers using a bipolar electrode assembly
US6132586A Method and apparatus for non-contact metal plating of semiconductor wafers using a bipolar electrode assembly
US5855792A Rinse water recycling method for semiconductor wafer processing equipment
US5885147A Apparatus for conditioning polishing pads
US5870793A Brush for scrubbing semiconductor wafers
US5851140A Semiconductor wafer polishing apparatus with a flexible carrier plate
US5664990A Slurry recycling in CMP apparatus
US5643061A Pneumatic polishing head for CMP apparatus
US5555474A Automatic rejection of diffraction effects in thin film metrology
US5567255A Solid annular gas discharge electrode
US5563709A Apparatus for measuring, thinning and flattening silicon structures
US5555472A Method and apparatus for measuring film thickness in multilayer thin film stack by comparison to a reference library of theoretical signatures
US5610102A Method for co-registering semiconductor wafers undergoing work in one or more blind process modules
US5227001A Integrated dry-wet semiconductor layer removal apparatus and method