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MARINE INSTR CO LTD

Overview
  • Total Patents
    123
About

MARINE INSTR CO LTD has a total of 123 patent applications. Its first patent ever was published in 1984. It filed its patents most often in Japan. Its main competitors in its focus markets semiconductors, measurement and machines are ZHANGJIAGANG CASS SEMICONDUCTOR CO LTD, SHANDONG AOTIAN ENVIRONMENTAL PROTECTION TECH CO LTD and ASE ASSEMBLY AND TEST SHANGHAI LTD.

Patent filings in countries

World map showing MARINE INSTR CO LTDs patent filings in countries
# Country Total Patents
#1 Japan 123

Patent filings per year

Chart showing MARINE INSTR CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Miyoshi Hideaki 19
#2 Takano Tadashi 11
#3 Hashimoto Yoshiki 9
#4 Nishimaki Kouji 8
#5 Okubo Teru 7
#6 Kubo Kazuki 6
#7 Uzawa Takao 5
#8 Kamiharashi Takashi 5
#9 Uramoto Iwami 4
#10 Watanabe Yasunori 4

Latest patents

Publication Filing date Title
JPH03114239A Bonding surface contact detecting equipment
JPH03243880A Screen display method for underwater acoustic detector
JPH03233395A Sound wavepropagation time measuring method
JPH03229439A Wire-bonding apparatus capable of wiring inspection
JPH03229440A Wire-bonding apparatus capable of wiring inspection
JPH03229441A Semiconductor assembling device
JPH03216577A Underwater acoustic detector
JPH03216575A Underwater acoustic detector
JPH03217039A Inspection of wire bonding and wire bonder
JPH03216576A Clutter erasing apparatus of fishfinder
JPH03198731A Method for watching width of net mouth of trawlnet
JPH03199991A Fishfinder for weighing and transmitter-receiver
JPH03195972A Ultrasonic wave transmitting and receiving system
JPH03195988A Echo-sounding machine
JPH03185846A Automatic lapping film feeding device mounted on bonding device
JPH03177037A Mechanism and method for detecting off-set amount between tool and camera of bonding device
JPH03174736A Automatic leveling mechanism for tape bonder
JPH03160737A Tape bonding method
JPH03155140A Automatic magazine feeder
JPH03155154A Cooling method for lead frame and cooling mechanism thereof