GB0314514D0
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Deposition methods and apparatus
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US6876154B2
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Plasma processing apparatus
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GB0302908D0
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Electrostatic clamping of thin wafers in plasma processing vacuum chamber
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GB0404866D0
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Forming low K dielectric layers
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WO03043062A1
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Method of forming a patterned metal layer
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US6929831B2
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Methods of forming nitride films
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GB0400229D0
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Low dielectric constant layers
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WO03008660A1
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Depositing a tantalum film
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GB0215699D0
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Deposition methods and apparatus
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GB0206116D0
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Depositing a tantalum file
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GB0203452D0
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Plasma processing apparatus
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GB0201590D0
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Depositing a tantalum film
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WO0247110A1
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Magnetron sputtering apparatus
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GB0127474D0
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Forming low k dielectric layers
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GB0127075D0
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Method of forming a patterned metal layer
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GB0124356D0
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Low dielectric constant layers
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GB0122333D0
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Method of forming nitride films
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GB0118417D0
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A method of depositing a dielectric film
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GB0117599D0
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Depositing a tantalum film
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GB0117600D0
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Semiconductor structure
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