YOON HYUNGSUK ALEXANDER has a total of 14 patent applications. Its first patent ever was published in 2006. It filed its patents most often in United States. Its main competitors in its focus markets semiconductors, surface technology and coating and chemical engineering are TRIKON EQUIP LTD, ASM INT NV and CLARK ROBERT D.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 14 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Surface technology and coating | |
#3 | Chemical engineering | |
#4 | Electrical machinery and energy | |
#5 | Machines |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Coating metallic material | |
#3 | Electric discharge tubes | |
#4 | Plasma technique | |
#5 | Unspecified technologies | |
#6 | Cleaning |
# | Name | Total Patents |
---|---|---|
#1 | Yoon Hyungsuk Alexander | 14 |
#2 | Dordi Yezdi | 8 |
#3 | Redeker Fritz C | 7 |
#4 | Boyd John M | 6 |
#5 | Korolik Mikhail | 6 |
#6 | Bailey Iii Andrew D | 5 |
#7 | Ryder Jason A | 3 |
#8 | Redecker Fritz | 2 |
#9 | Hoffmann Stephan P | 2 |
#10 | Boyd John | 2 |
Publication | Filing date | Title |
---|---|---|
US2008299772A1 | Methods of fabricating electronic devices using direct copper plating | |
US2008260963A1 | Apparatus and method for pre and post treatment of atomic layer deposition | |
US2008260967A1 | Apparatus and method for integrated surface treatment and film deposition | |
US2008261412A1 | Apparatus and method for atomic layer deposition | |
US2008057198A1 | Method for barrier interface preparation of copper interconnect | |
US2009113656A1 | Apparatus for isolated bevel edge clean and method for using the same |