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TAMURA SEISAKUSHO KK

Overview
  • Total Patents
    3,336
  • GoodIP Patent Rank
    1,532
  • Filing trend
    ⇧ 14.0%
About

TAMURA SEISAKUSHO KK has a total of 3,336 patent applications. It increased the IP activity by 14.0%. Its first patent ever was published in 1972. It filed its patents most often in Japan, China and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets semiconductors, machine tools and electrical machinery and energy are IM JAMES S, MACKAY JOHN and PAC TECH GMBH.

Patent filings per year

Chart showing TAMURA SEISAKUSHO KKs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Sasaki Kohei 175
#2 Masuda Tsugunori 161
#3 Onozaki Junichi 157
#4 Okano Teruo 154
#5 Suzuki Kotaro 125
#6 Oshima Yasuo 98
#7 Abe Nobuhide 91
#8 Arai Masaya 83
#9 Iizuka Kazuyuki 77
#10 Takahashi Takao 76

Latest patents

Publication Filing date Title
WO2021066054A1 Wavelength conversion member
JP2021005725A Electronic component
WO2021060152A1 Gate drive circuit
JP2020202401A Manufacturing method of reactor
KR20210031374A A photosensitive resin composition, dry films comprising the composition, and a printed circuit board comprising a product produced by photo-cure of the composition
WO2021029364A1 Wavelength conversion member
JP2020163473A Solder alloy and solder composition
EP3771305A1 Electronic device unit
EP3817153A1 Electronic device unit
JP2020105530A Curable resin composition for inkjet
JP2020114604A Lead-free solder alloy, solder welding material, electronic circuit mounting substrate and electronic control device
JP2020100560A Crystal laminate structure
JP2020158765A Photosensitive resin composition
CN111665685A Photosensitive resin composition
CN111724965A Soft magnetic powder and method for producing same, and dust core and method for producing same
JP2020096197A Schottky barrier diode
WO2020179759A1 Molding solder and method for preparing same, and soldering method
JP2020142300A Formed solder, its manufacturing method and solder welding method
JP2020147742A Photosensitive resin composition
JP2020074653A Communication system