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SUZHOU GALLANT PREC MACHINING CO LTD

Overview
  • Total Patents
    21
  • GoodIP Patent Rank
    86,404
  • Filing trend
    ⇩ 100.0%
About

SUZHOU GALLANT PREC MACHINING CO LTD has a total of 21 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2012. It filed its patents most often in China. Its main competitors in its focus markets semiconductors, machines and electrical machinery and energy are NANTONG SHANGMING PREC MOLD CO LTD, TECHWIN OPTO ELECTRONICS CO LTD and SLEPCEVIC DUSAN.

Patent filings in countries

World map showing SUZHOU GALLANT PREC MACHINING CO LTDs patent filings in countries
# Country Total Patents
#1 China 21

Patent filings per year

Chart showing SUZHOU GALLANT PREC MACHINING CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Lai Hongneng 8
#2 Shi Dunzhi 7
#3 Huang Liangyin 7
#4 Zhang Muqing 5
#5 Xu Zhihong 5
#6 Lin Yushang 3
#7 Jiang Zhiyuan 3
#8 Chen Shiwei 2
#9 Lai Junkui 2
#10 Gu Naiming 2

Latest patents

Publication Filing date Title
CN111554604A Joining device with improved precision and speed
CN111431357A Automatic packaging equipment for magnetic steel of motor rotor core
CN110815686A Carrier plate hot-pressing mold sealing equipment and method thereof
CN110718492A Tray body collection module and method thereof
CN110660709A Thin wafer separation method and apparatus
CN110676202A Pick-and-place alignment device and method thereof
CN110690152A Large-size wafer bonding device
CN110011497A A kind of motor rotor core magnetic slot glue-pouring device
CN109980868A A kind of motor rotor core magnetic slot glue injection equipment
CN107745965A A kind of fetching device
CN107662818A Fully automatic high-speed tray filling machine
CN106483622A There is provided and check and the automatic focusing mechanism measuring and its method
CN105059969A Material sheet turnover device and method
CN104900574A Positioning device for wafer processing and positioning method thereof
CN104441750A Press with thickness measuring capacity and method of press
CN103579056A Device for bonding semiconductor chips
CN102738021A Positioning structure of semi-conductor chip cantilever package