PYXIS CF PTE LTD has a total of 13 patent applications. Its first patent ever was published in 2019. It filed its patents most often in United States, China and Taiwan. Its main competitors in its focus markets semiconductors, machines and surface technology and coating are NANTONG SHANGMING PREC MOLD CO LTD, TECHWIN OPTO ELECTRONICS CO LTD and NAKAJIMA TOSHIO.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 6 | |
#2 | China | 4 | |
#3 | Taiwan | 3 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Machines | |
#3 | Surface technology and coating |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Certain plastics | |
#3 | Shaping of plastics | |
#4 | Electrolytic coating production | |
#5 | Metallic material removal |
# | Name | Total Patents |
---|---|---|
#1 | Sen Amlan | 12 |
#2 | Baheerathan Navaneetha Kumaran | 3 |
#3 | Lee Wai Hoe | 1 |
#4 | Chua Chian Soon | 1 |
#5 | Guan Qing Feng | 1 |
#6 | Son Amran | 1 |
Publication | Filing date | Title |
---|---|---|
US2021118841A1 | Post bond inspection of devices for panel packaging | |
US2020307037A1 | Compression molding machine and method of compression molding | |
US2020312780A1 | Panel level packaging for devices | |
CN111403301A | Automatic panel processing device and automatic panel processing method | |
US2021111045A1 | Wetting processing apparatus and operation method thereof | |
TW202014074A | Apparatus and method for semiconductor device bonding and mechanism for aligning a plurality of semiconductor devices | |
TW202035802A | Plating apparatus and operation method thereof |