| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 10 | |
| #2 | EPO (European Patent Office) | 5 |
| # | Industry | |
|---|---|---|
| #1 | Surface technology and coating | |
| #2 | Semiconductors | |
| #3 | Machines | |
| #4 | Measurement | |
| #5 | Electrical machinery and energy |
| # | Technology | |
|---|---|---|
| #1 | Coating metallic material | |
| #2 | Semiconductor devices | |
| #3 | Unspecified technologies | |
| #4 | Measuring temperature | |
| #5 | Single-crystal-growth | |
| #6 | Electric discharge tubes |
| # | Name | Total Patents |
|---|---|---|
| #1 | Price J B | 14 |
| #2 | Wu Schyi-Yi | 4 |
| #3 | Mendonca John | 4 |
| #4 | Rosler Richard S | 3 |
| #5 | Stitz Robert W | 3 |
| #6 | Stitz Robert William | 3 |
| #7 | Bunch Matthew Leroy | 2 |
| #8 | Bunch Matthew L | 2 |
| #9 | Chow Yu Chang | 2 |
| #10 | Shekerjian Brian H | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US4966869A | Tungsten disilicide CVD | |
| US4777061A | Blanket tungsten deposition for dielectric | |
| US4749597A | Process for CVD of tungsten | |
| US4861563A | Vacuum load lock | |
| US4788416A | Direct wafer temperature control | |
| US4737474A | Silicide to silicon bonding process | |
| EP0212116A1 | CVD temperature control | |
| US4692343A | Plasma enhanced CVD | |
| US4607591A | CVD heater control circuit | |
| US4632057A | CVD plasma reactor | |
| US4640224A | CVD heat source |