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SNTEK CO LTD

Overview
  • Total Patents
    121
  • GoodIP Patent Rank
    21,127
  • Filing trend
    ⇩ 91.0%
About

SNTEK CO LTD has a total of 121 patent applications. It decreased the IP activity by 91.0%. Its first patent ever was published in 2004. It filed its patents most often in Republic of Korea, WIPO (World Intellectual Property Organization) and Taiwan. Its main competitors in its focus markets semiconductors, surface technology and coating and electrical machinery and energy are ULVAC INC, INOCT CO LTD and JU SUNG ENGINEERING CO LTD.

Patent filings in countries

World map showing SNTEK CO LTDs patent filings in countries

Patent filings per year

Chart showing SNTEK CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 An Kyoung Joon 105
#2 Jung Sung Hun 50
#3 Bae Jeong Woon 31
#4 Kwon O Dae 27
#5 Kim Chan Ho 21
#6 Baek Ju Yeoul 20
#7 Park Kang Il 19
#8 Choi Sang Dae 19
#9 Ahn Kyoung Joon 7
#10 Yeom Jung Hoon 5

Latest patents

Publication Filing date Title
WO2019221413A1 Wafer for plasma measurement
WO2018199601A1 Sensor-mounted wafer
KR20190076100A Sensor mounted wafer for detecting launch condition of process, and apparatus therefor
KR20190074353A temporature correction apparatus for sensor mounted wafer
KR20190066193A Wafer Sensor with Function of RF Noise Protection
KR20190064163A Apparatus and Method for Producing Inorganic Barrier Layer using Laser Scan in Chemical Vapor Deposition Equipment
KR101929023B1 Purification Reactor with Multi-Layer Structure
KR20190032743A Sensor and Apparatus for Measuring Gas Flow
KR101958728B1 Apparatus for Measuring Plasma Uniformity
KR20190019266A Plasma monitoring device
KR20190012320A Bonding Material for device bonding having bonding-surface layers with different coefficient of expansion, and Preparing method thereof
KR20190009982A Bonding Material for device bonding having bonding-conductive layer and bonding-surface layer, and Preparing method thereof
KR20190009556A Bonding Material for device bonding, and Preparing method thereof
KR20180121305A Processing method of package using grooved plate
KR20180121304A Processing method of package using package substrate
KR101807495B1 dual-type sensor mounted wafer
KR101807492B1 sensor mounted wafer
KR20180120011A Power supply unit for sylindrical cathode and deposition apparatus having the power supply unit
KR20180120021A Continuous feeder of deposition source and plasma beam deposition apparatus having the feeder
KR20180115433A Process chamber including sample holder tightly contact with film