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SILTERRA MALAYSIA SDN BHD

Overview
  • Total Patents
    36
  • GoodIP Patent Rank
    174,237
  • Filing trend
    ⇧ 33.0%
About

SILTERRA MALAYSIA SDN BHD has a total of 36 patent applications. It increased the IP activity by 33.0%. Its first patent ever was published in 2002. It filed its patents most often in United States, Malaysia and Taiwan. Its main competitors in its focus markets semiconductors, micro-structure and nano-technology and machines are HANGZHOU SILAN INTEGRATED CIRCUIT CO LTD, SHIH HUI-SHEN and STMICROELECTRONICS MALTA LTD.

Patent filings in countries

World map showing SILTERRA MALAYSIA SDN BHDs patent filings in countries

Patent filings per year

Chart showing SILTERRA MALAYSIA SDN BHDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Kantimahanti Arjun Kumar 10
#2 Kim Inki 8
#3 Paek Min 8
#4 Soundara Pandian Mohanraj 8
#5 Kim Sang Yeon 8
#6 Chien Choong Shiau 6
#7 Inoue Naoto 6
#8 Lee Wan Gie 6
#9 Watanabe Hitomi 6
#10 Lam Zadig 5

Latest patents

Publication Filing date Title
US2020013880A1 Integrated circuit device with faraday shield
US2019100427A1 Monolithic integration of PMUT on CMOS
TW201929276A Monolithic integrated device
US2018151622A1 Monolithic integrated device
MY165848A Parallel stacked symmetrical and differential inductor
MY160081A Method for manufacturing a planarised reflective layer for micromirror devices
MY162310A Method for fabricating a bottom oxide layer in a trench
MY136744A An improved on-chip capacitor
MY140780A Via etch monitoring
MY130517A Semiconductor device with dual gate oxides
MY141557A Shallow trench isolation
MY130338A Method of forming ultra shallow junctions
MY135311A Static pad conditioner
US6864956B1 Dual phase grating alignment marks
US2004166698A1 Semiconductor device with dual gate oxides
US2004161897A1 Semiconductor device having multiple gate oxide layers and method of manufacturing thereof
US2004147090A1 Shallow trench isolation
US2004058287A1 Pre-heating dilution gas before mixing with steam in diffusion furnace
US2004083976A1 Modified deposition ring to eliminate backside and wafer edge coating
US6821190B1 Static pad conditioner