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SILICON BANDWIDTH INC

Overview
  • Total Patents
    64
About

SILICON BANDWIDTH INC has a total of 64 patent applications. Its first patent ever was published in 1994. It filed its patents most often in United States, EPO (European Patent Office) and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets semiconductors, electrical machinery and energy and audio-visual technology are NAT CENTER FOR ADVANCED PACKAGING CO LTD, JUXIN TECHNOLOGY CO LTD and FRENCH WILLIAM.

Patent filings in countries

World map showing SILICON BANDWIDTH INCs patent filings in countries

Patent filings per year

Chart showing SILICON BANDWIDTH INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Jeon Myoung-Soo 27
#2 Crane Jr Stanford W 27
#3 Krishnapura Lakshminarasimha 25
#4 Crane Stanford W Jr 22
#5 Crane Stanford W 13
#6 Dutta Arindum 11
#7 Horvath Zsolt 10
#8 Portuondo Maria M 8
#9 Li Yun 8
#10 Link Kevin 8

Latest patents

Publication Filing date Title
US2006067031A1 Decoupling capacitor for an integrated circuit and method of manufacturing thereof
US6905367B2 Modular coaxial electrical interconnect system having a modular frame and electrically shielded signal paths and a method of making the same
US2003162319A1 Micro grid array semiconductor die package
US6700138B2 Modular semiconductor die package and method of manufacturing thereof
US7070340B2 High performance optoelectronic packaging assembly
US6797882B1 Die package for connection to a substrate
US7135768B2 Hermetic seal
US6847115B2 Packaged semiconductor device for radio frequency shielding
US6603193B2 Semiconductor package
US6663294B2 Optoelectronic packaging assembly
US2002117751A1 Semiconductor die package having mesh power and ground planes
US6203347B1 High-density electrical interconnect system
US6305987B1 Integrated connector and semiconductor die package
US6307258B1 Open-cavity semiconductor die package
US6141869A Apparatus for and method of manufacturing a semiconductor die carrier
US6078102A Semiconductor die package for mounting in horizontal and upright configurations
US6247972B1 Electrical connector assembly with a female electrical connector having internal flexible contact arm
US6339191B1 Prefabricated semiconductor chip carrier