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KYOCERA AMERICA INC

Overview
  • Total Patents
    67
  • GoodIP Patent Rank
    190,672
About

KYOCERA AMERICA INC has a total of 67 patent applications. Its first patent ever was published in 1989. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and Canada. Its main competitors in its focus markets semiconductors, telecommunications and optics are NAT CT FOR ADVANCED PACKAGING, NAT CT ADVANCED PACKAGING CO LTD NCAP CHINA and GLO AB.

Patent filings per year

Chart showing KYOCERA AMERICA INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Garland Paul 12
#2 Aguirre Gerardo 10
#3 Mccoy John Washington 8
#4 Luu Linda 7
#5 Lobsinger Joshua 7
#6 Venegas Jeffrey 7
#7 Lobsinger Joshua David 6
#8 Shane Michael John 6
#9 Miyauchi Nobuaki 6
#10 Nomura Aki 5

Latest patents

Publication Filing date Title
US2016377823A1 Optical module and optical module package incorporating a high-thermal-expansion ceramic substrate
US2016035686A1 Methods of forming flip chip systems
WO2015153903A1 Heat management in electronics packaging
US2008200068A1 Broadband RF connector interconnect for multilayer electronic packages
US2006109063A1 Matching for ring hybrid
US2006038633A1 Impedence matching along verticle path of microwave vias in multilayer packages
US2004232529A1 Semiconductor package having filler metal of gold/silver/copper alloy
US2004195662A1 Semiconductor package having non-ceramic based window frame
US6727117B1 Semiconductor substrate having copper/diamond composite material and method of making same
US2003068141A1 Opto-electronic package for integrated sealing of optical fibers
US2003015350A1 Feedthrough assembly having cut-out areas in metal housing adjacent ceramic feedthrough
US6441697B1 Ultra-low-loss feedthrough for microwave circuit package
US6204448B1 High frequency microwave packaging having a dielectric gap
US6046707A Ceramic multilayer helical antenna for portable radio or microwave communication apparatus
US5314606A Leadless ceramic package with improved solderabilty
US5160747A Apparatus for manufacturing ceramic chip-resistant chamfered integrated circuit package
US5345038A Multi-layer ceramic packages
US5258575A Ceramic glass integrated circuit package with integral ground and power planes
US5134246A Ceramic-glass integrated circuit package with integral ground and power planes
US5196919A Use of a contamination shield during the manufacture of semiconductor packages