| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 6 | |
| #2 | WIPO (World Intellectual Property Organization) | 4 | |
| #3 | Australia | 1 | |
| #4 | EPO (European Patent Office) | 1 | |
| #5 | Japan | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Machines | |
| #3 | Audio-visual technology |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Unspecified technologies | |
| #3 | Casings and printed circuits |
| # | Name | Total Patents |
|---|---|---|
| #1 | Estes Richard H | 12 |
| #2 | Akita Masanori | 8 |
| #3 | Mori Toshihiro | 8 |
| #4 | Ito Koji | 8 |
| #5 | Wada Minoru | 7 |
| #6 | Clayton James E | 4 |
| #7 | Kulesza Frank W | 3 |
| Publication | Filing date | Title |
|---|---|---|
| WO0217392A2 | Polymer redistribution of flip chip bond pads | |
| US6410415B1 | Flip chip mounting technique | |
| US6189208B1 | Flip chip mounting technique |