Learn more

STAKTEK CORP

Overview
  • Total Patents
    55
About

STAKTEK CORP has a total of 55 patent applications. Its first patent ever was published in 1991. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and Australia. Its main competitors in its focus markets semiconductors, machines and audio-visual technology are POLYMER FLIP CHIP CORP, EPIC TECHNOLOGIES INC and CHEN KONG-CHEN.

Patent filings in countries

World map showing STAKTEK CORPs patent filings in countries
# Country Total Patents
#1 United States 49
#2 WIPO (World Intellectual Property Organization) 3
#3 Australia 2
#4 EPO (European Patent Office) 1

Patent filings per year

Chart showing STAKTEK CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Burns Carmen D 48
#2 Roane Jerry M 10
#3 Cady James W 10
#4 Troetschel Phillip R 5
#5 Roane Jerry 3

Latest patents

Publication Filing date Title
US6025642A Ultra high density integrated circuit packages
US5945732A Apparatus and method of manufacturing a warp resistant thermally conductive integrated circuit package
US5778522A Method of manufacturing a high density integrated circuit module with complex electrical interconnect rails having electrical interconnect strain relief
US5588205A Method of manufacturing a high density integrated circuit module having complex electrical interconnect rails
US5615475A Method of manufacturing an integrated package having a pair of die on a common lead frame
US5801437A Three-dimensional warp-resistant integrated circuit module method and apparatus
US5644161A Ultra-high density warp-resistant memory module
US5804870A Hermetically sealed integrated circuit lead-on package configuration
US5499160A High density integrated circuit module with snap-on rail assemblies
US5592364A High density integrated circuit module with complex electrical interconnect rails
US5702985A Hermetically sealed ceramic integrated circuit heat dissipating package fabrication method
US5455740A Bus communication system for stacked high density integrated circuit packages
US5377077A Ultra high density integrated circuit packages method and apparatus
US5498906A Capacitive coupling configuration for an intergrated circuit package
US5446620A Ultra high density integrated circuit packages
US5367766A Ultra high density integrated circuit packages method
US5369056A Warp-resistent ultra-thin integrated circuit package fabrication method
US5484959A High density lead-on-package fabrication method and apparatus
US5236117A Impact solder method and apparatus
US5371866A Simulcast standard multichip memory addressing system