NAT CENTER FOR ADVANCED PACKAGING CO LTD has a total of 17 patent applications. It decreased the IP activity by 25.0%. Its first patent ever was published in 2014. It filed its patents most often in WIPO (World Intellectual Property Organization) and United States. Its main competitors in its focus markets semiconductors, optics and audio-visual technology are KANG PIL-KYU, KYOTO SEMICONDUCTOR CO LTD and NAT CENTER FOR ADVANCED PACKAGING CO LTD (NCAP CHINA).
# | Country | Total Patents | |
---|---|---|---|
#1 | WIPO (World Intellectual Property Organization) | 10 | |
#2 | United States | 7 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Optics | |
#3 | Audio-visual technology | |
#4 | Measurement | |
#5 | Machines |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Optical systems | |
#3 | Casings and printed circuits | |
#4 | Radio navigation | |
#5 | Measuring force, work and fluid pressure | |
#6 | Unspecified technologies |
# | Name | Total Patents |
---|---|---|
#1 | Cao Liqiang | 5 |
#2 | Sun Peng | 4 |
#3 | Zhang Wenqi | 3 |
#4 | Yu Zhongyao | 3 |
#5 | Xue Haiyun | 3 |
#6 | Chen Feng | 3 |
#7 | Lin Tingyu | 2 |
#8 | Ren Yulong | 2 |
#9 | Lu Yuan | 2 |
#10 | Yao Daping | 1 |
Publication | Filing date | Title |
---|---|---|
WO2019033608A1 | Radar module package and fabrication method therefor | |
WO2018086395A1 | Semiconductor memory, semiconductor storage module and manufacturing method therefor | |
US2016037680A1 | Heat dissipation solution for advanced chip packages | |
US2015311093A1 | Method for polishing a polymer surface |