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SIGURD MICROELECTRONICS CORP

Overview
  • Total Patents
    32
  • GoodIP Patent Rank
    188,188
  • Filing trend
    ⇩ 100.0%
About

SIGURD MICROELECTRONICS CORP has a total of 32 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2005. It filed its patents most often in Taiwan, United States and China. Its main competitors in its focus markets semiconductors, measurement and audio-visual technology are TEH WENG HONG, INFINEON TECH DRESDEN GMBH & CO KG and INFINEON TECHNOLOGIES DRESDEN GMBH.

Patent filings in countries

World map showing SIGURD MICROELECTRONICS CORPs patent filings in countries
# Country Total Patents
#1 Taiwan 16
#2 United States 10
#3 China 5
#4 Republic of Korea 1

Patent filings per year

Chart showing SIGURD MICROELECTRONICS CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Chen Bo-Hong 11
#2 Chen Po-Hung 6
#3 Chen Mao-Rong 6
#4 Ye Can-Lian 3
#5 Chen Mao-Jung 3
#6 Ye Canlian 2
#7 Pang Si-Quan 2
#8 Liu Chiu-Wei 2
#9 Yeh Tsan-Lien 2
#10 Shen Kuan-Dian 2

Latest patents

Publication Filing date Title
US9831197B1 Wafer-level package with metal shielding structure and the manufacturing method thereof
CN108231743A Wafer scale metallic shield encapsulating structure and its manufacturing method
TW201820551A Wafer-level metallic shielding package structure, and fabrication method thereof capable of protecting components from electromagnetic interference and reducing device volume
US2016207762A1 Sensor package structure and method
TW201624682A Packaging structure and method of sensor
US2016146920A1 Rf parameter calibration method
KR20150026295A Optical sensor package device
CN104425477A Optical sensor packaging device
TW201508904A Optical sensor packaging device
US2014042305A1 Optical package module
TW201445152A Method for calibrating radio frequency parameter
US7297918B1 Image sensor package structure and image sensing module
TW200802750A Image sensor package structure and image sensing module
CN1959994A Capsulation structure of light sensing chip
US2007063129A1 Packaging structure of a light-sensing device with a spacer wall
US2007057356A1 Image sensing chip package structure
US2007090504A1 Optical sensor chip package
TWI267202B Photo sensor device package structure with minute packaging area
TW200713623A Package structure of photo sensor
CN1924691A Capsulation structure for optical sensitive module