| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Republic of Korea | 8 | |
| #2 | Taiwan | 7 | |
| #3 | United States | 6 | |
| #4 | WIPO (World Intellectual Property Organization) | 5 | |
| #5 | EPO (European Patent Office) | 4 | |
| #6 | Hong Kong | 1 | |
| #7 | Singapore | 1 |
| # | Industry | |
|---|---|---|
| #1 | Basic materials chemistry | |
| #2 | Semiconductors | |
| #3 | Materials and metallurgy | |
| #4 | Surface technology and coating | |
| #5 | Furniture and games | |
| #6 | Chemical engineering | |
| #7 | Machine tools |
| # | Name | Total Patents |
|---|---|---|
| #1 | Mahulikar Deepak | 32 |
| #2 | Mohseni Saeed H | 14 |
| #3 | Hu Bin | 13 |
| #4 | Wang Yuhu | 9 |
| #5 | Delbridge Ken A | 9 |
| #6 | Moyaerts Gert R M | 8 |
| #7 | Wen Richard | 8 |
| #8 | Koontz Nichole R | 6 |
| #9 | Wen Liqing | 5 |
| #10 | Sayles Gerome J | 5 |
| Publication | Filing date | Title |
|---|---|---|
| TW201326375A | Homogeneous blending | |
| KR20110134384A | Fluid processing | |
| TW201114862A | Highly dilutable polishing concentrates and slurries | |
| WO2009020625A1 | Copper polishing slurry | |
| KR20080059266A | Ultrapure colloidal silica for use in chemical mechanical polishing applications | |
| US2006283095A1 | Fumed silica to colloidal silica conversion process | |
| US2006124593A1 | Colloidal silica based chemical mechanical polishing slurry | |
| US2004082275A1 | Continuous chemical mechanical polishing process for polishing multiple conductive and non-conductive layers on semiconductor wafers |