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DUPONT AIR PROD NANOMATERIALS

Overview
  • Total Patents
    78
About

DUPONT AIR PROD NANOMATERIALS has a total of 78 patent applications. Its first patent ever was published in 1997. It filed its patents most often in United States, Republic of Korea and Japan. Its main competitors in its focus markets basic materials chemistry, semiconductors and surface technology and coating are CABOT MICROELECTRONICS CORP, ANJI MICROELECTRONICS TECH SHANGHAI CO LTD and UBMATERIALS LNC.

Patent filings per year

Chart showing DUPONT AIR PROD NANOMATERIALSs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Siddiqui Junaid Ahmed 38
#2 Small Robert J 22
#3 Compton Timothy Frederick 12
#4 Richards Robin Edward 10
#5 Usmani Saifi 10
#6 Mcconnell Rachel Dianne 9
#7 Castillo Daniel Hernandez 6
#8 Hu Bin 5
#9 Palmer Bentley J 5
#10 Fu Bin 4

Latest patents

Publication Filing date Title
KR20110035987A Method for exposing through-base wafer vias for fabrication of stacked devices
US2011237079A1 Method for exposing through-base wafer vias for fabrication of stacked devices
US2010081279A1 Method for Forming Through-base Wafer Vias in Fabrication of Stacked Devices
US2009061630A1 Method for Chemical Mechanical Planarization of A Metal-containing Substrate
US2009057661A1 Method for chemical mechanical planarization of chalcogenide materials
US2009057834A1 Method for chemical mechanical planarization of chalcogenide materials
US2009047870A1 Reverse Shallow Trench Isolation Process
KR20080058272A Method and slurry for reducing corrosion on tungsten during chemical mechanical polishing
JP2008182213A Method of adjusting low-k to cooper removing speed during chemimechanical polishing, and slurry
JP2008160112A Composition for chemical mechanical planarization of copper
TW200806781A Fluoride-modified silica sols for chemical mechanical planarization
US2008182485A1 Method for immobilizing ligands and organometallic compounds on silica surface, and their application in chemical mechanical planarization
KR20090045145A Polishing composition for silicon wafer, composition kit for silicon wafer polishing, and methods of polishing silicon wafer
KR20090045223A Silicon wafer polishing composition and method of polishing silicon wafer
US2007049025A1 Chemical-mechanical planarization composition having ketooxime compounds and associated method for use
WO2006105020A1 Dihydroxy enol compounds used in chemical mechanical polishing compositions having metal ion oxidizers
US2006117667A1 Free radical-forming activator attached to solid and used to enhance CMP formulations
US2006162261A1 Composition and associated method for catalyzing removal rates of dielectric films during chemical mechanical planarization
US2006046490A1 Chemical-mechanical planarization composition having benzenesulfonic acid and per-compound oxidizing agents, and associated method for use
US2005258139A1 Polishing method to reduce dishing of tungsten on a dielectric