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US6085414A
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Method of making a flexible circuit with raised features protruding from two surfaces and products therefrom
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US6007351A
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Bussplate
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US6303988B1
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Wafer scale burn-in socket
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US5971773A
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Solderless electrical connector
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US6152608A
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Snap lock connector for optical fiber systems
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US5971772A
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Low profile clamping mechanism for connecting a printed circuit board to a flexible printed circuit
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US6033234A
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Printed circuit board to flexible printed circuit connection system
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US5934926A
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Electrical connector system with pre-staged feature
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US5990695A
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Membrane test probe
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US6166333A
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Bumps with plural under-bump dielectric layers
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US5856641A
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Switch having raised contact features and a deflectable substrate
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US6007669A
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Layer to layer interconnect
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US6313402B1
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Stress relief bend useful in an integrated circuit redistribution patch
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US5896271A
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Integrated circuit with a chip on dot and a heat sink
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US5924193A
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Method of making mandrels and circuits therefrom
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US5762845A
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Method of making circuit with conductive and non-conductive raised features
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US5946555A
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Wafer level decal for minimal packaging of chips
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US5777484A
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Device for testing integrated circuit chips during vibration
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US5714732A
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Latching switch
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US5790377A
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Integral copper column with solder bump flip chip
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