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SHENZHEN ZHIJIN ELECTRONICS CO LTD

Overview
  • Total Patents
    16
  • GoodIP Patent Rank
    119,122
About

SHENZHEN ZHIJIN ELECTRONICS CO LTD has a total of 16 patent applications. Its first patent ever was published in 2012. It filed its patents most often in China. Its main competitors in its focus markets semiconductors, audio-visual technology and electrical machinery and energy are SCHWEIZER ELECTRONIC AG, NORTH KK and SHANGHAI LANPEI NEW MATERIAL TECHNOLOGY CO LTD.

Patent filings in countries

World map showing SHENZHEN ZHIJIN ELECTRONICS CO LTDs patent filings in countries
# Country Total Patents
#1 China 16

Patent filings per year

Chart showing SHENZHEN ZHIJIN ELECTRONICS CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Kang Xiaoheng 16
#2 Li Rui 11
#3 Xu Kai 11
#4 Cai Kelin 11
#5 Jiang Leyuan 8
#6 Tang Bo 8
#7 Yang Fei 8
#8 Ni Chao 3
#9 Qiu Longzhou 3

Latest patents

Publication Filing date Title
CN112087888A Multilayer circuit board preparation method and multilayer circuit board
CN112218429A Circuit board preparation method and circuit board
CN111244247A Mini LED packaging substrate manufacturing process
CN111182739A Circuit board preparation method
CN111182733A Circuit board manufacturing process with side wall circuit and circuit board manufacturing process
CN111146092A Packaging substrate manufacturing process
CN111243965A Preparation method of packaging substrate
CN111244028A Packaging substrate manufacturing process
CN109904079A Package substrate manufacturing process, package substrate and chip-packaging structure
CN109841531A Package substrate manufacturing process, package substrate and wafer packaging structure
CN109935521A Package substrate manufacturing process, package substrate and chip-packaging structure
CN108493025A A kind of touch base plate and preparation method thereof
CN104282824A Method for manufacturing high-power high-reflectance COB substrate and light source
CN103763864A Method for manufacturing novel white glass substrate
CN103579030A Novel chip encapsulation method and chip encapsulation structure
CN102931319A Manufacturing method for LED (Light-Emitting Diode) package substrate with high thermal conductivity