EP3076772A2
|
|
Fusion bonded liquid crystal polymer electrical circuit structure
|
US2015013901A1
|
|
Matrix defined electrical circuit structure
|
WO2015006393A1
|
|
Fusion bonded liquid crystal polymer circuit structure
|
US2014242816A1
|
|
Selective metalization of electrical connector or socket housing
|
US2014220797A1
|
|
Method of making an electronic interconnect
|
WO2014011228A1
|
|
High speed circuit assembly with integral terminal and mating bias loading electrical connector assembly
|
WO2012122142A2
|
|
Selective metalization of electrical connector or socket housing
|
WO2012125331A1
|
|
Copper pillar full metal via electrical circuit structure
|
WO2012078493A1
|
|
Electrical interconnect ic device socket
|
WO2012074963A1
|
|
High performance surface mount electrical interconnect
|
WO2012074969A2
|
|
Electrical interconnect ic device socket
|
WO2012061008A1
|
|
High performance electrical circuit structure
|
WO2011139619A1
|
|
Semiconductor device package adapter
|
WO2011002712A1
|
|
Singulated semiconductor device separable electrical interconnect
|
WO2010147934A1
|
|
Semiconductor die terminal
|
WO2010141316A1
|
|
Compliant printed circuit wafer probe diagnostic tool
|
WO2010141311A1
|
|
Compliant printed circuit area array semiconductor device package
|
WO2010141318A1
|
|
Compliant printed circuit peripheral lead semiconductor test socket
|
WO2010141298A1
|
|
Composite polymer-metal electrical contacts
|
WO2010141297A1
|
|
Compliant printed circuit wafer level semiconductor package
|