Keypad for integrated circuit cards comprises a first film layer forming a contact dome provided with a conducting contact coating, a second film layer, and a self-adhering coating on the whole surface of the second film layer
DE10222847A1
Piezoelectric oscillator structure for inserting in the card body of a chip card has an oscillator board, piezoceramic transformer elements and electric contacts
DE10222848A1
Chip card product marking configuration for identifying products has electronic components embedded in a chip card's flat card body at a definite point
DE10220107A1
Process for contacting contact surfaces on active surface of semiconductor chip used in flip-chip technology comprises forming perforations in circuit board, fixing the chip on the circuit board and guiding connection onto strip conductor
DE10216526A1
Conductor track extrusion, comprises dispensing a continual profile section with a conductor, and stabilizing and solidifying the section on a substrate
DE10206440A1
Circuit board through-hole connection method, by filling holes or openings with conductive adhesive and mounting SMD components
DE10206442A1
Targetted passivation of conductive track intermediate space or track regions on circuit board by applying conductive adhesive in region of tracks formed
DE10206435A1
Adhesive bonding process for forming electrically conducting structures on a substrate comprises using a conducting adhesive or similar material having selected properties
DE10206438A1
Method for forming and creating strip conductor structures on a substrate prepares a draft circuit for electrostatic charge patterns to generate a strip conductor structure.
DE10206441A1
Substrate surface used as support for components in microelectronics industry, e.g. thermal sensor, comprises layer containing conducting particles, and support layer acting as the base support for conducting layer
DE10206436A1
Defined manufacture of electrical components on substrate involves forming electrically conductive structures in applied adhesive, setting adhesive to fix conductive structures
DE10206434A1
Process for the selective metallization of partial structures or regions comprises applying a conducting adhesive or producing a conducting path on a substrate, and selectively depositing metal on the conducting adhesive
DE10206437A1
Production of conducting pathways on a substrate e.g. in microelectronics comprises applying a defined conducting adhesive on the substrate, partially hardening and repeating the previous steps
DE10206433A1
Device for producing electrical elements e.g. resistors comprises a capillary arrangement in a dispensing arrangement for applying a conducting adhesive
DE10206439A1
Method for producing strip conductor structures as a connection between electrical/electrooptical component terminals uses a thread-type conductor line to go between terminals to be linked and to contact them with its ends.
WO0203322A1
Method for producing a card-type data carrier and a device for carrying out said method
