|
US2014192498A1
|
|
Direct metalization of electrical circuit structures
|
|
US2012199985A1
|
|
Compliant core peripheral lead semiconductor test socket
|
|
US2012202364A1
|
|
Compliant conductive nano-particle electrical interconnect
|
|
US2012244728A1
|
|
High performance surface mount electrical interconnect with external biased normal force loading
|
|
US2012168948A1
|
|
Copper pillar full metal via electrical circuit structure
|
|
US2012171907A1
|
|
Selective metalization of electrical connector or socket housing
|
|
US2012182035A1
|
|
Bumped semiconductor wafer or die level electrical interconnect
|
|
US2012161317A1
|
|
Area array semiconductor device package interconnect structure with optional package-to-package or flexible circuit to package connection
|
|
US2012164888A1
|
|
Metalized pad to electrical contact interface
|
|
US2013210276A1
|
|
Electrical interconnect IC device socket
|
|
US2013078860A1
|
|
Electrical connector insulator housing
|
|
US2013203273A1
|
|
High speed backplane connector
|
|
US2012056640A1
|
|
Compliant printed circuit semiconductor tester interface
|
|
US2012051016A1
|
|
Method of forming a semiconductor socket
|
|
US2012061851A1
|
|
Simulated wirebond semiconductor package
|
|
US2012268155A1
|
|
Compliant printed circuit socket diagnostic tool
|
|
US2012043130A1
|
|
Resilient conductive electrical interconnect
|
|
US2012043667A1
|
|
Compliant printed circuit semiconductor package
|
|
US2012055702A1
|
|
Compliant printed flexible circuit
|
|
US2012055701A1
|
|
High performance surface mount electrical interconnect
|
