OBSIDIAN SENSORS INC has a total of 32 patent applications. It decreased the IP activity by 20.0%. Its first patent ever was published in 2016. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and Taiwan. Its main competitors in its focus markets micro-structure and nano-technology, measurement and audio-visual technology are Meridian Innovation Pte Ltd, YANTAI RAYTRON TECH CO LTD and XU JINGHUI.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 10 | |
#2 | WIPO (World Intellectual Property Organization) | 9 | |
#3 | Taiwan | 7 | |
#4 | China | 2 | |
#5 | EPO (European Patent Office) | 2 | |
#6 | Republic of Korea | 2 |
# | Industry | |
---|---|---|
#1 | Micro-structure and nano-technology | |
#2 | Measurement | |
#3 | Audio-visual technology | |
#4 | Semiconductors | |
#5 | Computer technology | |
#6 | Optics |
# | Name | Total Patents |
---|---|---|
#1 | Hong John | 24 |
#2 | Chang Tallis | 21 |
#3 | Wen Bing | 21 |
#4 | Chan Edward | 20 |
#5 | Pan Yaoling | 19 |
#6 | Andrews Sean | 7 |
#7 | Ma Jian | 5 |
#8 | Ryu Seung-Tak | 5 |
#9 | Hong John Hyunchul | 3 |
#10 | Nomura Kenji | 3 |
Publication | Filing date | Title |
---|---|---|
WO2021061839A1 | In-display fingerprint sensing system | |
WO2020033930A2 | Mems radiation sensors and systems | |
KR20200142575A | Readout circuits and methods | |
US10735683B1 | Systems and methods for low-power image digitization | |
WO2019183259A1 | Capping plate for panel scale packaging of mems products | |
WO2019178402A1 | Mems and nems structures | |
US2018364439A1 | Wafer level integrated optics in packaging for imaging sensor application | |
US2018230004A1 | Panel level packaging for MEMS application | |
US2018138102A1 | Integrated packaging devices and methods with backside interconnections | |
US2018052056A1 | Thermomechanical device for measuring electromagnetic radiation | |
US2017366747A1 | Generating high resolution images |