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BOWLES PHILIP H

Overview
  • Total Patents
    14
  • GoodIP Patent Rank
    184,295
About

BOWLES PHILIP H has a total of 14 patent applications. Its first patent ever was published in 2012. It filed its patents most often in United States. Its main competitors in its focus markets micro-structure and nano-technology, semiconductors and measurement are VANGUARD INT SEMICONDUCTOR SINGAPORE PTE LTD, XU JINGHUI and REINMUTH JOCHEN.

Patent filings in countries

World map showing BOWLES PHILIP Hs patent filings in countries
# Country Total Patents
#1 United States 14

Patent filings per year

Chart showing BOWLES PHILIP Hs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Bowles Philip H 14
#2 Hooper Stephen R 11
#3 Roop Raymond M 3
#4 Holm Paige M 3
#5 Hayes Scott M 1
#6 Liu Lianjun 1

Latest patents

Publication Filing date Title
US2017038209A1 Microelectronic packages having split gyroscope structures and methods for the fabrication thereof
US2015298966A1 Sensor package having stacked die
US2015274515A1 Microelectronic packages having axially-partitioned hermetic cavities and methods for the fabrication thereof
US2016167952A1 Microelectronic packages having hermetic cavities and methods for the production thereof
US9108841B1 Microelectronic packages having stacked accelerometer and magnetometer die and methods for the production thereof
US9018029B1 Vent hole sealing in multiple die sensor device
US2015061044A1 Sequential wafer bonding
US2014061883A1 Leadframes, air-cavity packages, and electronic devices with offset vent holes, and methods of their manufacture
US8659167B1 Sensor packaging method and sensor packages
US2014054798A1 Sensor packages and method of packaging dies of differing sizes
US2014048946A1 Sensor packages and method of packaging dies of various sizes
US2014015123A1 Sensor package and method of forming same