|
CN107026097A
|
|
A kind of method of the measurement extension SOI epilayer resistance rates of Non-contact nondestructive wound
|
|
CN106992142A
|
|
A kind of preparation method of nanoscale ultrathin membrane TM-SOI silicon chips
|
|
CN106992141A
|
|
It is a kind of to prepare the method with super thick buried regions oxide layer soi wafer
|
|
CN106992140A
|
|
A kind of method that use laser sliver technology prepares soi wafer
|
|
CN106981451A
|
|
A kind of method of removal TM-SOI top layer defect silicons
|
|
CN106409650A
|
|
Silicon-wafer direct bonding method
|
|
CN106409649A
|
|
Multilayer SOI material and preparation method thereof
|
