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NODA SCREEN CO LTD

Overview
  • Total Patents
    76
  • GoodIP Patent Rank
    34,647
  • Filing trend
    ⇩ 75.0%
About

NODA SCREEN CO LTD has a total of 76 patent applications. It decreased the IP activity by 75.0%. Its first patent ever was published in 1998. It filed its patents most often in China, United States and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets semiconductors, audio-visual technology and electrical machinery and energy are CIRCUIT COMPONENTS INC, TAKADA KATSUMI and SHINDO DENSHI KOGYO KK.

Patent filings per year

Chart showing NODA SCREEN CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Oyamada Seisei 31
#2 Yoshizawa Masamitsu 17
#3 Ogawa Hirotaka 16
#4 Hattori Atsunori 14
#5 Murakami Keiichi 11
#6 Kusumoto Kazuki 5
#7 Hatano Hirotaka 5
#8 Ojima Yasuhiro 3
#9 Keiichi Murakami 2
#10 Tsunozaki Kentarou 2

Latest patents

Publication Filing date Title
CN110100290A LC resonance element and resonance element arrays
KR20190117789A Semiconductor device provided with thin film capacitor structure and said thin film capacitor structure
US2018261665A1 Thin film capacitor and semiconductor device
WO2017203607A1 Intermediate connector, semiconductor device equipped with intermediate connector, and method for manufacturing intermediate connector
US9761544B1 Semiconductor device
TW201626525A Semiconductor device
KR20170002373A Semiconductor memory device
WO2016162938A1 Semiconductor device
CN106463468A Thin film capacitor manufacturing method, integrated circuit mounting substrate, and semiconductor device provided with integrated circuit mounting substrate
TW201445678A Semiconductor device
CN1972976A Graft copolymer, coating material, and method of forming coating film
TW200514489A Method for producing printed wiring board
TW200410620A Manufacturing method of printed wiring substrate
TW200410617A Manufacturing method of printed wiring substrate
WO2004054336A1 Method for manufacturing printed wiring board
CN1709016A Method for manufacturing printed circuit board
KR20050090992A Method for manufacturing printed wiring board
WO0059028A1 Method and apparatus for forming solder bumps
US6165544A Method of exposure of photo-curing resin applied to printed circuit board