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CA2333403A1
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Wideband rf port structure using coplanar waveguide and bga i/o
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High-performance digital ic package using bga-type i/o format and single-layer ceramic plate board by bimetal filling via
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A low cost, high performance package for microwave circuits in the up to 90 GHZ frequency range
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Device for interconnecting integrated circuit packages to circuit boards
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Multilayer printed wiring board
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Multiple resonant frequency decoupling capacitor
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High dielectric constant material
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Array connector
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