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DENSE PAC MICROSYSTEMS INC

Overview
  • Total Patents
    21
About

DENSE PAC MICROSYSTEMS INC has a total of 21 patent applications. Its first patent ever was published in 1988. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and EPO (European Patent Office). Its main competitors in its focus markets semiconductors, audio-visual technology and environmental technology are METTLER ROLLIN W JUN, LITECOOL LTD and CHEN NAN-JANG.

Patent filings per year

Chart showing DENSE PAC MICROSYSTEMS INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Isaak Harlan R 5
#2 Forthun John A 4
#3 Isaak Harlan Ruben 4
#4 Eide Floyd K 4
#5 Isaak Harlan 3
#6 Ross Andrew C 2
#7 Eide Floyd Kenneth 2
#8 Issak Harlan R 2
#9 Levy Aaron Uri 1
#10 Sprint John Patrick 1

Latest patents

Publication Filing date Title
US6627984B2 Chip stack with differing chip package types
WO0191173A1 Stackable flex circuit chip package and method of making same
US6404043B1 Panel stacking of BGA devices to form three-dimensional modules
US6323060B1 Stackable flex circuit IC package and method of making same
WO9957765A1 Chip stack and method of making same
US6222737B1 Universal package and method of forming the same
US5869353A Modular panel stacking process
US5612570A Chip stack and method of making same
US5313096A IC chip package having chip attached to and wire bonded within an overlying substrate
US4956694A Integrated circuit chip stacking