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NIPPON MEKTRON KK

Overview
  • Total Patents
    2,634
  • GoodIP Patent Rank
    6,093
  • Filing trend
    ⇧ 50.0%
About

NIPPON MEKTRON KK has a total of 2,634 patent applications. It increased the IP activity by 50.0%. Its first patent ever was published in 1974. It filed its patents most often in Japan, United States and Taiwan. Its main competitors in its focus markets audio-visual technology, macromolecular chemistry and polymers and machines are NIPPON KOKUEN KOGYO KK, NIPPON CMK KK and MULTI KK.

Patent filings per year

Chart showing NIPPON MEKTRON KKs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Matsuda Fumihiko 210
#2 Tatsu Harumi 121
#3 Tatsu Haruyoshi 103
#4 Akatsuka Takatoshi 87
#5 Toyama Jiro 80
#6 Okabe Jun 79
#7 Inaba Masakazu 79
#8 Takano Shoji 78
#9 Enokida Takashi 61
#10 Tanaka Hideaki 59

Latest patents

Publication Filing date Title
US2021084768A1 Method for manufacturing substrate for flexible printed wiring board, and substrate for flexible printed wiring board
WO2021014787A1 Wiring member for battery and battery device
US2021046309A1 Stretchable wiring board and electrical muscle stimulating device
JP2021005535A Cylindrical heater
JP2020202060A Wiring material and battery module
JP2020147659A Adhesive sheet
JP2020098689A Connection terminal with seal mechanism and electric apparatus
JP2020096094A Metal-clad substrate
JP2020090564A Adhesive film, adhesive composition, and flexible printed circuit board
JP2020085695A Probe device, electricity inspection device, and method for inspecting electricity
JP2020087691A Battery monitoring unit
JP2020082453A Conductor-clad laminate plate and production method of conductor-clad laminate plate
JP2020087607A Support member and battery module
JP2020019635A Sheet take-out device and method for manufacturing flexible printed circuit board
JP2020021550A Flexible wiring board and battery module
JP2020017634A Method for manufacturing multilayer printed wiring board and multilayer printed wiring board
JP2020004841A Entry sheet for boring, method for manufacturing entry sheet for boring, and method for manufacturing electronic substrate
JP2019184509A Pressure sensor and method for manufacturing pressure sensor
JP2019171696A Laminating apparatus and method of manufacturing flexible printed circuit board
JP2019145624A Substrate connection structure and method for manufacturing substrate connection structure