AT&S (CHINA) CO LTD has a total of 16 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2015. It filed its patents most often in WIPO (World Intellectual Property Organization), China and United States. Its main competitors in its focus markets audio-visual technology, semiconductors and machines are IBIDEN DENSHI KOGYO KK, SIMMTECH CO LTD and BOLUO KONKA EXACTITUDE SCIENCE TECH CO LTD.
# | Country | Total Patents | |
---|---|---|---|
#1 | WIPO (World Intellectual Property Organization) | 8 | |
#2 | China | 3 | |
#3 | United States | 3 | |
#4 | EPO (European Patent Office) | 1 | |
#5 | Republic of Korea | 1 |
# | Industry | |
---|---|---|
#1 | Audio-visual technology | |
#2 | Semiconductors | |
#3 | Machines | |
#4 | Machine tools | |
#5 | Basic materials chemistry |
# | Technology | |
---|---|---|
#1 | Casings and printed circuits | |
#2 | Semiconductor devices | |
#3 | Certain plastics | |
#4 | Shaping of plastics | |
#5 | Turning | |
#6 | Adhesives | |
#7 | Fillers | |
#8 | Sawing |
# | Name | Total Patents |
---|---|---|
#1 | Tuominen Mikael | 6 |
#2 | Tay Annie | 5 |
#3 | Philips Dai | 3 |
#4 | Di Gregorio Giordano | 3 |
#5 | Bauer-Oeppinger Nikolaus | 3 |
#6 | Gregorio Di Giordano | 3 |
#7 | N Bauer-Oeppinger | 3 |
#8 | Annie Tay | 3 |
#9 | Dai Philips | 3 |
#10 | Bauer-Öppinger Nikolaus | 2 |
Publication | Filing date | Title |
---|---|---|
WO2017168323A1 | Electronic component embedded by laminated sheet | |
EP3200570A1 | Component carrier comprising a copper filled multiple-diameter laser drilled bore | |
WO2017115332A1 | Reamer-drill bit for drilling and smoothing a hole in a component carrier | |
CN106550554A | For manufacturing the protection structure of two pieces above parts carrier with pseudo- core and different materials | |
CN106550532A | For manufacturing the protection structure including lazy flow material of parts carrier | |
CN106550542A | Insert protection structure and there is near protection structure the parts carrier of prefect dielectric layer |