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KINGTRON ELECTRONICS CO LTD

Overview
  • Total Patents
    17
About

KINGTRON ELECTRONICS CO LTD has a total of 17 patent applications. Its first patent ever was published in 2002. It filed its patents most often in Taiwan, United States and China. Its main competitors in its focus markets audio-visual technology, semiconductors and machines are SCHOELLER ELECTRONICS GMBH, NIPPON CMK KK and FUKUI PREC COMPONENTS SHENZHEN CO LTD.

Patent filings in countries

World map showing KINGTRON ELECTRONICS CO LTDs patent filings in countries
# Country Total Patents
#1 Taiwan 14
#2 United States 2
#3 China 1

Patent filings per year

Chart showing KINGTRON ELECTRONICS CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Wu Chien-Nan 14
#2 Hu Dyi-Chung 12
#3 Huang Chih-Kung 4
#4 Lin Jen-Chien 4
#5 Lo Cheng-Heng 2
#6 Diqun Hu 1
#7 Chung Chin-Fu 1
#8 Yang Keng-Chung 1
#9 Jung Jin-Fu 1
#10 Huang Wei-Chien 1

Latest patents

Publication Filing date Title
TW200926930A Method for fabricating electronic component carrier
TW200807577A Manufacturing method of film carrier
CN1899827A Etching and micro-photographing process for spray nozzle sheet
TWI256717B Chip on film package structure
TW200633857A Etching and photolithography processes for fabricating nozzle plate
TWI245677B Drilling manufacturing process of contacts on film carrier and laser drilling method thereof
TWI246171B Manufacturing process of contact window for chip and of openings for contact and transmission on film carrier
TWI246366B Flexible printed circuit board
TWI246367B Flexible printed circuit board of print head and manufacturing method thereof
TWI246950B Manufacturing process of position aperture on film carrier for chip on film and laser drilling thereof
TW200612790A Electronic package and flexible printed circuit board thereof
TWI231585B Manufacturing method of film carrier
TWI236742B Manufacturing method of film carrier
TWI234182B Flexible carrier and flexible circuit board
TW543164B Tape structure and fabrication method thereof