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NAT CENTER FOR ADVANCED PACKAGING CO LTD (NCAP CHINA)

Overview
  • Total Patents
    105
  • GoodIP Patent Rank
    13,638
  • Filing trend
    ⇩ 100.0%
About

NAT CENTER FOR ADVANCED PACKAGING CO LTD (NCAP CHINA) has a total of 105 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2015. It filed its patents most often in China. Its main competitors in its focus markets semiconductors, optics and audio-visual technology are UNITIVE INT LTD, KIM YU-SIK and NAT CT ADVANCED PACKAGING CO LTD NCAP CHINA.

Patent filings in countries

World map showing NAT CENTER FOR ADVANCED PACKAGING CO LTD (NCAP CHINA)s patent filings in countries
# Country Total Patents
#1 China 105

Patent filings per year

Chart showing NAT CENTER FOR ADVANCED PACKAGING CO LTD (NCAP CHINA)s patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Feng Guangjian 17
#2 Chen Feng 17
#3 Yu Zhongyao 15
#4 Zhang Wenqi 13
#5 Cao Liqiang 11
#6 Sun Peng 10
#7 Xue Haiyun 10
#8 Guo Xueping 9
#9 Lin Tingyu 8
#10 Ren Yulong 6

Latest patents

Publication Filing date Title
CN111146194A System-in-package structure and manufacturing method
CN111128977A Packaging structure and packaging method of multilayer chip
CN107221505A A kind of chip packaging method
CN107180790A A kind of wafer clipping time computational methods and device
CN107146762A The structure and its manufacture method of a kind of coreless substrate
CN107195554A A kind of wafer packaging method
CN107195613A Three-dimension packaging structure and its manufacture method based on different height copper post
CN107195617A Three-dimension packaging structure and its manufacture method based on different height copper post
CN107093599A The encapsulating structure of multi-chip
CN107123601A A kind of high radiating element encapsulating structure and board level manufacturing method
CN107146781A It is a kind of to have core plate structure and its manufacture method for the two-sided of BOT encapsulation
CN107104091A A kind of half embedment circuit substrate structure and its manufacture method
CN107041078A The manufacture method of high density flexible substrate
CN107123626A A kind of manufacture method of high radiating element encapsulation
CN107204333A A kind of flexible substrate package structure and its method for packing
CN107017212A High-density system-in-package structure and its manufacture method
CN107068659A A kind of fan-out-type integrated chip antenna packages structure and method
CN107063860A The test system of thin-film material, method of testing, test structure and preparation method thereof
CN106876345A Plate level embedment encapsulating structure and the method for packing of a kind of power electronic devices
CN106920784A The fan-out package structure and method for packing of a kind of power electronic devices