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HU DYI CHUNG

Overview
  • Total Patents
    58
  • GoodIP Patent Rank
    25,333
  • Filing trend
    ⇩ 66.0%
About

HU DYI CHUNG has a total of 58 patent applications. It decreased the IP activity by 66.0%. Its first patent ever was published in 2015. It filed its patents most often in United States, Taiwan and China. Its main competitors in its focus markets semiconductors, audio-visual technology and measurement are BRIDGE SEMICONDUCTOR CORP, ZHUHAI ACCESS SEMICONDUCTOR CO LTD and SILICON BASE DEV INC.

Patent filings in countries

World map showing HU DYI CHUNGs patent filings in countries

Patent filings per year

Chart showing HU DYI CHUNGs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Hu Dyi-Chung 45
#2 Hu Dyi Chung 13

Latest patents

Publication Filing date Title
US2020411442A1 Package substrate and package structure
US2021020577A1 Semiconductor package and manufacturing method thereof
TW202027247A Substrate structure with high-density wiring and manufacturing method thereof
US2020118898A1 Carrier for chip packaging and manufacturing method thereof
US2020033381A1 Space transformer and manufacturing method thereof
US2019181112A1 Substrate structure and electronic device having coarse redistribution layer electrically connected to fine redistribution layer
TW201927086A Substrate structure and electronic device
US2018350731A1 Package substrate and package structure
US2019148273A1 Package substrate and package structure
US2018053723A1 Package structure having embedded bonding film and manufacturing method thereof
US2018166371A1 Package structure and manufacturing method thereof
US2018012774A1 Electronic package and manufacturing method thereof
CN107689358A Metal pad structure
CN107424974A Package substrate with flush type noise shielding wall
CN107230644A Metal column with metal sponge
US9972604B1 Joint structure for metal pillars
US10002852B1 Package on package configuration
US2017125348A1 System in package
US2018122736A1 Glass fiber reinforced package substrate
US2017278779A1 Package substrate with embedded circuit