| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Japan | 15 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Computer technology | |
| #3 | Machines |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Static stores | |
| #3 | Unspecified technologies | |
| #4 | Electric digital data processing | |
| #5 | Unspecified technologies |
| # | Name | Total Patents |
|---|---|---|
| #1 | Yuu-Pin Han | 5 |
| #2 | Shiyuu Shii Shiyan | 3 |
| #3 | Robaato Oo Miraa | 3 |
| #4 | Fuu-Tai Riyuu | 2 |
| #5 | Maikeru Ee Ora | 2 |
| #6 | Furanku Aaru Buraianto | 2 |
| #7 | Robaato Eichi Bondo | 2 |
| #8 | Rin Suii Garison | 2 |
| #9 | Maatein Taunzu | 1 |
| #10 | Kureigu Kurei Heifuaa | 1 |
| Publication | Filing date | Title |
|---|---|---|
| JPS63190346A | General purpose lead frame carrier and insert for holding semiconductor chip and bonding the semiconductor chip to leads of lead frame | |
| JPS63278253A | Method of levelling for double metal layers |