MEMSIC SEMICONDUCTOR (WUXI) CO LTD has a total of 12 patent applications. Its first patent ever was published in 2015. It filed its patents most often in China, United States and Taiwan. Its main competitors in its focus markets measurement, micro-structure and nano-technology and semiconductors are TOHOKU SEIKI IND, NANONEXUS INC and KANKYO DENJI GIJUTSU KENKYUSHO.
# | Country | Total Patents | |
---|---|---|---|
#1 | China | 7 | |
#2 | United States | 4 | |
#3 | Taiwan | 1 |
# | Industry | |
---|---|---|
#1 | Measurement | |
#2 | Micro-structure and nano-technology | |
#3 | Semiconductors | |
#4 | Computer technology |
# | Technology | |
---|---|---|
#1 | Measuring electric variables | |
#2 | Semiconductor devices | |
#3 | Making microstructural devices | |
#4 | Microstructural devices | |
#5 | Measuring distances | |
#6 | Counting mechanisms |
# | Name | Total Patents |
---|---|---|
#1 | Jiang Leyue | 8 |
#2 | Li Bin | 6 |
#3 | Rao Jie | 3 |
#4 | Zhao Yang | 3 |
#5 | Peng Wanhua | 2 |
#6 | Yan Guopu | 2 |
#7 | Wen Biao | 2 |
#8 | Wu Liang | 2 |
#9 | Li Junying | 2 |
#10 | Liu Haidong | 2 |
Publication | Filing date | Title |
---|---|---|
US2017115363A1 | Magnetic Field Sensor With Three-Dimensional Spiral Reset Coil | |
CN105911490A | Magnetic field sensor with self-check set lead | |
CN105668502A | Airtight encapsulating structure with cavity device and manufacturing method thereof | |
CN105565248A | Airtight package structure with cavity device and manufacturing method thereof | |
CN105552054A | Wafer-level package structure and manufacturing method thereof | |
CN105469137A | Reciting-chanting auxiliary device and system thereof | |
CN105510675A | Single-chip current sensor | |
CN105403219A | Bicycle navigation system based on MEMS (Micro-electromechanical Systems) |