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NANONEXUS INC

Overview
  • Total Patents
    54
About

NANONEXUS INC has a total of 54 patent applications. Its first patent ever was published in 2000. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and Australia. Its main competitors in its focus markets measurement, semiconductors and audio-visual technology are TOHOKU SEIKI IND, SCANIMETRICS INC and HASEGAWA YOSHIEI.

Patent filings per year

Chart showing NANONEXUS INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Mok Sammy 39
#2 Chong Fu Chiung 36
#3 Chong Fu-Chiung 10
#4 Swiatowiec Frank 10
#5 Lahiri Syamal Kumar 10
#6 Chieh Erh-Kong 9
#7 Haemer Joseph Michael 6
#8 Doan David Thanh 6
#9 Modlin Douglas 6
#10 Milter Roman L 5

Latest patents

Publication Filing date Title
TW200848742A Structures and processes for fabrication of probe card assemblies with multi-layer interconnect
WO2008070673A2 Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
WO2007131194A2 Apparatus and methods for processing, testing, and packaging of semiconductor ics and image sensors
WO2007115053A2 Fine pitch microfabricated spring contact structure and method
WO2007011751A2 Method and apparatus for producing controlled stresses and stress gradients in sputtered films
KR20070093450A High density interconnect system for ic packages and interconnect assemblies
US2006186906A1 High density interconnect system for IC packages and interconnect assemblies
CN101019473A High density interconnect system having rapid fabrication cycle
US2005275418A1 High density interconnect system having rapid fabrication cycle
US2006240690A9 Enhanced stress metal spring contactor
US7349223B2 Enhanced compliant probe card systems having improved planarity
TW200528571A Method and apparatus for producing uniform, isotropic stresses in a sputtered film
AU2003218288A1 A miniaturized contact spring
CN1643741A A miniaturized contact spring
US7126220B2 Miniaturized contact spring
CN1575350A Method and apparatus of producing uniform isotropic stresses in a sputtered film
US6710609B2 Mosaic decal probe
US6917525B2 Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs
AU6863001A Systems for testing and packaging integraged circuits
US6799976B1 Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies