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STECO LTD

Overview
  • Total Patents
    32
  • GoodIP Patent Rank
    152,253
  • Filing trend
    ⇩ 50.0%
About

STECO LTD has a total of 32 patent applications. It decreased the IP activity by 50.0%. Its first patent ever was published in 2001. It filed its patents most often in Republic of Korea, Japan and Taiwan. Its main competitors in its focus markets semiconductors, measurement and audio-visual technology are MCI COMPUTER GMBH, SECRON CO LTD and PAGANI ALBERTO.

Patent filings in countries

World map showing STECO LTDs patent filings in countries
# Country Total Patents
#1 Republic of Korea 29
#2 Japan 2
#3 Taiwan 1

Patent filings per year

Chart showing STECO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Kim Yun Sik 7
#2 Lee Ho Jae 5
#3 Han Pil Gyu 3
#4 Jeon Je Seog 3
#5 Lee Sung Soo 3
#6 Hwang Seong Yeon 2
#7 Yoon Suk Bum 2
#8 Sung Seung Sung 2
#9 Son Jung Chan 2
#10 Jeon Je Soek 2

Latest patents

Publication Filing date Title
KR102201929B1 Probe card
KR20200126657A Cof package
KR102038355B1 Inner lead bonding apparatus for preventable misalignmet
KR20180134507A Apparatus for bonding chip
KR20180119423A Apparatus for separating chip from mounting tape and method thereof
KR20170099636A Device mounting equipment and mounting method
KR20170089541A Board angle correction device and method
KR101688989B1 Ic separation equipment
KR20160043259A Bidirectional type package transferring apparatus and method thereof
KR20160012579A In-line cure apparatus for TCP COF package
KR20110082233A Apparatus for clamping film
KR20110049603A Semiconductor package, apparatus for testing semiconductor package and method using the same
KR20110004117A Cof package and test method thereof
KR20100050675A Cof package and method for manufacturing the same
KR20100023574A Method and apparatus for bonding semiconductor chip
KR20100022601A Bonding tool of inner lead bonding apparatus
KR20100010539A Bonding tool of inner lead bonding apparatus
KR20090114065A TAB tape guide roller of inner lead bonding apparatus
KR20090043268A Lead and semiconductor substrate
KR20090037558A Semiconductor package