| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 9 | |
| #2 | China | 4 | |
| #3 | Republic of Korea | 4 | |
| #4 | WIPO (World Intellectual Property Organization) | 3 | |
| #5 | EPO (European Patent Office) | 2 |
| # | Industry | |
|---|---|---|
| #1 | Surface technology and coating | |
| #2 | Electrical machinery and energy | |
| #3 | Chemical engineering | |
| #4 | Thermal processes | |
| #5 | Machine tools | |
| #6 | Semiconductors |
| # | Name | Total Patents |
|---|---|---|
| #1 | Iwata Hiroshi | 21 |
| #2 | Hashimoto Keiichi | 11 |
| #3 | Okada Naoya | 11 |
| #4 | Nedu Toshiyuki | 11 |
| #5 | Sato Ippei | 11 |
| #6 | Shibata Naonori | 11 |
| #7 | Takakuwa Yuta | 11 |
| #8 | Matsumoto Koyu | 1 |
| Publication | Filing date | Title |
|---|---|---|
| WO2021039764A1 | Multilayer structure and method for producing multilayer structure | |
| US2019333745A1 | Sputtering cathode, sputtering cathode assembly, and sputtering apparatus | |
| CN109881166A | The manufacturing method of sputter cathode, sputtering equipment and phragmoplast | |
| CN106736329A | Industrial cooling copper backboard manufacture method and friction-stir bonding machine |