| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Republic of Korea | 3 | |
| #2 | Taiwan | 3 | |
| #3 | WIPO (World Intellectual Property Organization) | 2 | |
| #4 | China | 1 | |
| #5 | EPO (European Patent Office) | 1 | |
| #6 | Japan | 1 | |
| #7 | Singapore | 1 | |
| #8 | United States | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices |
| # | Name | Total Patents |
|---|---|---|
| #1 | Li Tung Lok | 6 |
| #2 | Li Tunglok | 5 |
| #3 | Li Tang Rok | 1 |
| Publication | Filing date | Title |
|---|---|---|
| TW201131721A | Leadframe for ic package and method of manufacture | |
| WO2010111885A1 | Leadframe for ic package and method of manufacture | |
| KR20120085761A | Ic package and method for manufacturing the same | |
| KR20100121575A | Leadless integrated circuit package having high density contacts |