| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Finland | 2 | |
| #2 | Australia | 1 | |
| #3 | Brazil | 1 | |
| #4 | China | 1 | |
| #5 | EAPO (Eurasian Patent Organization) | 1 | |
| #6 | EPO (European Patent Office) | 1 | |
| #7 | Republic of Korea | 1 | |
| #8 | Malaysia | 1 | |
| #9 | Taiwan | 1 | |
| #10 | United States | 1 | |
| #11 | WIPO (World Intellectual Property Organization) | 1 |
| # | Name | Total Patents |
|---|---|---|
| #1 | Huhtasalo Lauri | 9 |
| #2 | Hanhikorpi Marko | 6 |
| #3 | Taskinen Pekka | 4 |
| #4 | Suortti Tuija | 4 |
| #5 | Stroemberg Samuli | 3 |
| #6 | Alho Juha-Pekka | 3 |
| #7 | Hyvarinen Olli | 3 |
| #8 | Viitanen Olli-Pekka | 2 |
| #9 | Stromberg Samuli | 2 |
| #10 | Sippola Elina | 2 |
| Publication | Filing date | Title |
|---|---|---|
| FI20085121A0 | A method for improving the electrical conductivity and adhesion of an electrical connection to a metal film conductor, as well as component adhesive, electrically conductive paste and electrically conductive coating | |
| FI20045235A0 | Procedure for treating an electrically conductive pattern |