LEGACY ELECTRONICS INC has a total of 44 patent applications. Its first patent ever was published in 1999. It filed its patents most often in United States, China and EPO (European Patent Office). Its main competitors in its focus markets audio-visual technology, semiconductors and machine tools are KINSUS INTERCONNECT TECH CORP, KINKO DENSHI KOFUN YUGENKOSHI and YANG CHIH-KUANG.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 12 | |
#2 | China | 5 | |
#3 | EPO (European Patent Office) | 5 | |
#4 | WIPO (World Intellectual Property Organization) | 5 | |
#5 | Australia | 4 | |
#6 | Hong Kong | 4 | |
#7 | Japan | 4 | |
#8 | Malaysia | 2 | |
#9 | Taiwan | 2 | |
#10 | Republic of Korea | 1 |
# | Industry | |
---|---|---|
#1 | Audio-visual technology | |
#2 | Semiconductors | |
#3 | Machine tools | |
#4 | Machines | |
#5 | Computer technology | |
#6 | Environmental technology |
# | Technology | |
---|---|---|
#1 | Casings and printed circuits | |
#2 | Semiconductor devices | |
#3 | Metal-working | |
#4 | Unspecified technologies | |
#5 | Climate change mitigation in goods production | |
#6 | Static stores |
# | Name | Total Patents |
---|---|---|
#1 | Engle Jason C | 27 |
#2 | Kledzik Kenneth J | 22 |
#3 | Kledzik Kenneth | 12 |
#4 | Kledizk Kenneth J | 4 |
#5 | Engle Jason | 3 |
#6 | Mecker Donald W | 2 |
#7 | Kenneth Kledzik | 1 |
#8 | Engle K J Kledzik J C | 1 |
#9 | Allee Greg | 1 |
#10 | Bradbury-Bennett Julie Roslyn | 1 |
Publication | Filing date | Title |
---|---|---|
WO2006076381A2 | Radial circuit board, system, and methods | |
US2006107524A1 | Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips | |
US7102892B2 | Modular integrated circuit chip carrier | |
AU2003216362A1 | A modular integrated circuit chip carrier | |
TW560232B | A method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips | |
MY131467A | Method for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips | |
EP1378152A2 | A method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips | |
US6713854B1 | Electronic circuit module with a carrier having a mounting pad array | |
US6545868B1 | Electronic module having canopy-type carriers | |
US6487078B2 | Electronic module having a three dimensional array of carrier-mounted integrated circuit packages | |
US6313998B1 | Circuit board assembly having a three dimensional array of integrated circuit packages |