INTRAGLOBAL CORP has a total of 11 patent applications. Its first patent ever was published in 2005. It filed its patents most often in WIPO (World Intellectual Property Organization), China and United States. Its main competitors in its focus markets semiconductors, electrical machinery and energy and audio-visual technology are KINKO DENSHI KOFUN YUGENKOSHI, TESSERA INTERCONNECT MATERIALS and NORTH CORP.
# | Country | Total Patents | |
---|---|---|---|
#1 | WIPO (World Intellectual Property Organization) | 4 | |
#2 | China | 3 | |
#3 | United States | 2 | |
#4 | EPO (European Patent Office) | 1 | |
#5 | Republic of Korea | 1 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Electrical machinery and energy | |
#3 | Audio-visual technology | |
#4 | Micro-structure and nano-technology | |
#5 | Machines | |
#6 | Environmental technology |
# | Name | Total Patents |
---|---|---|
#1 | Gregory John | 8 |
#2 | John Gregory | 3 |
Publication | Filing date | Title |
---|---|---|
WO2006057729A2 | Monolithic multi-level module and method | |
US2008179724A1 | Microelectronics Package and Method | |
US2008089039A1 | Method for Micropacking of Electrical or Electrochemical Devices and Micropackage | |
WO2006037068A2 | Method for micropackaging of leds and micropackage | |
CN101432873A | Method for micropackaging of electrical or electromechanical devices and micropackage | |
CN101438421A | Method for micropackaging of LEDs and micropackage |