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TESSERA INTERCONNECT MATERIALS

Overview
  • Total Patents
    33
About

TESSERA INTERCONNECT MATERIALS has a total of 33 patent applications. Its first patent ever was published in 2002. It filed its patents most often in United States, Japan and Republic of Korea. Its main competitors in its focus markets audio-visual technology, semiconductors and machines are NORTH CORP, ZHEN DING TECHNOLOGY CO LTD and MEIKO ELECTRONICS CO LTD.

Patent filings per year

Chart showing TESSERA INTERCONNECT MATERIALSs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Iijima Tomoo 12
#2 Endo Kimitaka 8
#3 Kurosawa Inetaro 6
#4 Ohsawa Masayuki 4
#5 Hashimoto Yukio 4
#6 Hyodo Kiyoshi 4
#7 Iijima Asao 4
#8 Kotake Hideki 4
#9 Endo Kimiyoshi 4
#10 Ohira Hiroshi 3

Latest patents

Publication Filing date Title
JP2009260402A Wiring circuit board, and manufacturing method thereof
US2010044860A1 Microelectronic substrate or element having conductive pads and metal posts joined thereto using bond layer
JP2009088572A Manufacturing method of wiring circuit board, wiring circuit board, and manufacturing method of multilayer wiring board
JP2009111417A Wiring circuit board
JP2008211256A Manufacturing method of member for wiring circuit
JP2009158593A Bump structure and method of manufacturing the same
US2010071944A1 Chip capacitor embedded pwb
JP2008098656A Inter-layer connecting material
JP2009123863A Method of forming bump structure and the bump structure
JP2007329514A Multilayer wiring circuit forming board, and manufacturing method therefor
US2008136041A1 Structure and method of making interconnect element having metal traces embedded in surface of dielectric
JP2007235167A Wiring circuit board
KR20070068445A Structure and method of making interconnect element having metal traces embedded in surface of dielectric
KR20070101213A Member for interconnecting wiring films and method for producing the same
US2005000729A1 Multilayer wiring board for an electronic device
EP1377145A1 Multilayer wiring board, method for producing multilayer wiring board, polisher for multilayer wiring board, and metal sheet for producing wiring board